Phone: +086 0755 85241496 E-mail: info@qycltd.com

Semiconductor Package Substrate Manufacturer

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About Company

Shen Zhen QYC TECHNOLOGY CO. ,LTD

We mainly produce 2-layer to 20-layer packaging substrate, minimum trace 9um, minimum spacing 9um. the best smallest via size are 50um. The Min Bomp Pithc are 100um. and most of the packaging substrate materials we used from Japan. South Korea.The material quality of the substrate is very stable.

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ABOUT US

Shen Zhen QYC TECHNOLOGYCO. ,LTD

We primarily manufacture packaging substrates ranging from 2 to 20 layers, with a minimum trace width of 9um and minimum spacing of 9um. The optimal smallest via size is 50um, while the minimum bump pitch is 100um. The majority of our packaging substrate materials are sourced from Japan and South Korea, known for their exceptionally stable quality.

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PRODUCTS

BT/ABF/Rogers Substrate

3D IC Package Substrate

Glass Package Substrate

Ceramic Package Substrate

LCC Package Substrate

CPU Package Substrate

MIS Package Substrate

WLP Package Substrate

CONTACT US

Phone: +086 0755 85241496

E-mail: info@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

Copyright © 2022 Shen Zhen QYC TECHNOLOGY CO. ,LTD All Rights Reserved.

+086 15014077679

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