Phone: +086 0755 85241496 E-mail: info@qycltd.com

Semiconductor Package Substrate Manufacturer

Menu

Home
Products
News
TECHNOLOGY
Contact
- Inquiry

Search

Products

Home

Products

Products Module Description

Cavity Package Substrate Manufacturer

Wire Bonding Substrates Manufacturer

SOP Package Substrate Manufacturer

SIP Package Substrate Manufacturer

PBGA Package Substrate Manufacturer

FCBGA Package Substrate Manufacturer

FCCSP Package Substrate Manufacturer

Posts navigation

1 2

Product

BT/ABF/Rogers Substrate Manufacturer
3D IC Package Substrate Manufacturer
Glass Package Substrate Manufacturer
Ceramic Package Substrate Manufacturer
LCC Package Substrate Manufacturer
CPU Package Substrate Manufacturer
MIS Package Substrate Manufacturer
WLP Package Substrate Manufacturer
High Frequency Package Substrate Manufacturer
IC/BGA Package Substrate Manufacturer
ABF(Ajinomoto) Substrate Manufacturer
Microtrace Package Substrate Manufacturer
Cavity Package Substrate Manufacturer
Wire Bonding Substrates Manufacturer
SOP Package Substrate Manufacturer

ABOUT US

Shen Zhen QYC TECHNOLOGYCO. ,LTD

We primarily manufacture packaging substrates ranging from 2 to 20 layers, with a minimum trace width of 9um and minimum spacing of 9um. The optimal smallest via size is 50um, while the minimum bump pitch is 100um. The majority of our packaging substrate materials are sourced from Japan and South Korea, known for their exceptionally stable quality.

QUICK LINKS

PRODUCTS

BT/ABF/Rogers Substrate

3D IC Package Substrate

Glass Package Substrate

Ceramic Package Substrate

LCC Package Substrate

CPU Package Substrate

MIS Package Substrate

WLP Package Substrate

CONTACT US

Phone: +086 0755 85241496

E-mail: info@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

Copyright © 2022 Shen Zhen QYC TECHNOLOGY CO. ,LTD All Rights Reserved.

+086 15014077679

Leave a message

Δ