Phone: +086 0755 85241496 E-mail: info@qycltd.com

Semiconductor Package Substrate Manufacturer

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WLP Package Substrate Manufacturer

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WLP Package Substrate Manufacturer

WLP Package Substrate Manufacturer

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ABOUT US

Shen Zhen QYC TECHNOLOGYCO. ,LTD

We primarily manufacture packaging substrates ranging from 2 to 20 layers, with a minimum trace width of 9um and minimum spacing of 9um. The optimal smallest via size is 50um, while the minimum bump pitch is 100um. The majority of our packaging substrate materials are sourced from Japan and South Korea, known for their exceptionally stable quality.

QUICK LINKS

PRODUCTS

BT/ABF/Rogers Substrate

3D IC Package Substrate

Glass Package Substrate

Ceramic Package Substrate

LCC Package Substrate

CPU Package Substrate

MIS Package Substrate

WLP Package Substrate

CONTACT US

Phone: +086 0755 85241496

E-mail: info@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

Copyright © 2022 Shen Zhen QYC TECHNOLOGY CO. ,LTD All Rights Reserved.

+086 15014077679

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