Semiconductor Package Substrate Manufacturer
About Us
We are a leading Semiconductor Packaging Substrate Manufacturer in the industry, with over 10,000 unique team members and a continuously growing and evolving professional team. This not only demonstrates our industry strength but also signifies the vast potential for future growth in our company.
Our product range covers various fields including FCCSP Package Substrate, FCBGA Package Substrate, PBGA Package Substrate, SIP Package Substrate, SOP Package Substrate, ensuring excellent quality of the packaging substrates we produce. Through state-of-the-art equipment, we pledge to provide the highest quality products with consistent stability, offering unparalleled reliability to our customers. Currently, we have produced a variety of 4 to 18-layer flip chip packaging substrates. Particularly for complex flip chip packaging substrates, such as 14-layer ABF material, we ensure high-quality production with efficient productivity. We take pride in our short production cycle of only 1 to 2 months, ensuring rapid delivery without compromising on product quality - every substrate meets impeccable manufacturing standards, showcasing our exceptional craftsmanship and technological prowess.
In terms of material selection for packaging substrates, we have multiple sources including top suppliers from Japan, Korea, Taiwan, and China. Depending on specific customer requirements, we carefully select and utilize the most suitable materials to manufacture substrates, ensuring each product precisely meets the expectations and standards of our customers.
