기술

Currently, our company can produce various high-density packaging substrates ranging from 4 layers to 18 레이어. We offer a variety of substrate materials specifically designed for small pitch packaging or circuit board designs. The minimum bump pitch is 100um, and the minimum trace and spacing can be reduced to 9um/9um. Most of our customers typically utilize trace and spacing within the range of 20um to 30um. It’s important to note that as the number of layers increases and trace/spacing decreases, our production costs also increase. Conversely, larger trace and spacing, as well as lower layer counts, can reduce production costs.

During the design process, if you have any questions or concerns about design details, please feel free to contact us. We offer free assistance to ensure that your design meets manufacturing requirements.

As all complete design data is currently confidential, we are unable to fully disclose specific design and production references. 그렇지만, we can provide some key data and information to help you better understand our manufacturing capabilities and services.

If you need more information or have specific design requirements, please don’t hesitate to contact us. We will make every effort to provide excellent packaging substrate solutions that meet your needs. We look forward to cooperating with you to achieve your project goals.