Phone: +086 0755 85241496      E-mail: info@qycltd.com

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Who are we?

About Us

We are a leading Semiconductor Packaging Substrate Manufacturer in the industry, with over 10,000 unique team members and a continuously growing and evolving professional team. This not only demonstrates our industry strength but also signifies the vast potential for future growth in our company.

Our product range covers various fields including FCCSP Package Substrate, FCBGA Package Substrate, PBGA Package Substrate, SIP Package Substrate, SOP Package Substrate, ensuring excellent quality of the packaging substrates we produce. Through state-of-the-art equipment, we pledge to provide the highest quality products with consistent stability, offering unparalleled reliability to our customers. Currently, we have produced a variety of 4 to 18-layer flip chip packaging substrates. Particularly for complex flip chip packaging substrates, such as 14-layer ABF material, we ensure high-quality production with efficient productivity. We take pride in our short production cycle of only 1 to 2 months, ensuring rapid delivery without compromising on product quality - every substrate meets impeccable manufacturing standards, showcasing our exceptional craftsmanship and technological prowess.

In terms of material selection for packaging substrates, we have multiple sources including top suppliers from Japan, Korea, Taiwan, and China. Depending on specific customer requirements, we carefully select and utilize the most suitable materials to manufacture substrates, ensuring each product precisely meets the expectations and standards of our customers.

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Why choose us?

We specialize in manufacturing high-quality, high-layer packaging substrates ranging from 2 to 20 layers. Our product offerings include a variety of substrates such as FCCSP Package Substrate, FCBGA Package Substrate, PBGA Package Substrate, SIP Package Substrate, SOP Package Substrate, Wire Bonding substrates, Cavity Package Substrate, Microtrace Package Substrate, ABF (Ajinomoto) Substrate, IC/BGA Package Substrate, High-Frequency Package Substrate, WLP Package Substrate, MIS Package Substrate, CPU Package Substrate, LCC Package Substrate, and packaging services. Additionally, we produce Microtrace HDI PCBs such as Microtrace LED PCBs and Microtrace Rogers PCBs.

When designing packaging substrates, if you have any questions about the manufacturing process or are unsure if the factory can perfectly execute your design requirements, we are here to provide consultation and support. Feel free to contact us via email, and our team of professional engineers will promptly respond to your inquiries. To ensure optimal execution and realization of your designs, we are committed to close collaboration with designers, identifying and addressing any process or technical issues they encounter. With a team of over 200 professional engineers, we establish partnerships with approximately 100 to 200 new customers from around the world each month. Some customers find us through online searches, while others are referred to us by long-standing clients. Our customers trust us not only because we consistently maintain stable, high-quality products but also because we utilize high-precision manufacturing equipment. We always use specified materials from designated brands according to customer specifications, ensuring that each product perfectly meets customer expectations and requirements. Our dedication and focus are the keys to consistently delivering quality products.

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